MP EN
品名 | 簡介 | 特性 |
---|---|---|
4925 | Full-gloss, low-lead and cadmium phosphorus chemical nickel solution, phosphorus content is 6-9%. Suitable for copper and iron materials. |
1.The uniformity of the coating thickness is good. 2. High tolerance for impurities. 3. Good gloss, stable and continuous. 4. The stability of the plating solution is very good. 5. The film thickness deposition rate is fast. 6. The plating layer has less porosity. |
4927 | Full-gloss, lead-free, cadmium, phosphorus chemical nickel solution, phosphorus content is 6-9%. Suitable for copper, iron, aluminum and aluminum alloy. |
1.The coating does not contain lead and cadmium. 2. Does not hurt the ink. 3. The appearance of gloss is good, stable and consistent. 4. The stability of the plating solution is very good. 5. The film thickness deposition rate is fast. 6. Long bath life. 7. 1:1 supplementary addition. |
4928 | Semi-gloss, lead-free, cadmium, phosphorus chemical nickel solution, phosphorus content is 6-9%. Suitable for copper and iron materials. |
1.The coating does not contain lead and cadmium. 2. The appearance of gloss is good, stable and consistent. 3. The stability of the plating solution is very good. 4. The film thickness deposition rate is fast. 5. Long bath life. 6. 1:1 supplementary addition. |
4929 | Full-gloss, low-lead and cadmium phosphorus chemical nickel solution, phosphorus content is 6-9%. Suitable for copper and iron materials. |
1.The coating does not contain lead and cadmium. 2. The appearance of gloss is good, stable and consistent. 3. The stability of the plating solution is very good. 4. The film thickness deposition rate is fast. 5. Long bath life. 6. 1:1 supplementary addition. |
9151 | Full-gloss, lead-free and cadmium-phosphorus chemical nickel solution with a phosphorus content of 6-9%, suitable for copper and iron materials. |
1.The coating does not contain lead and cadmium. 2. The appearance of gloss is good, stable and consistent. 3. The stability of the plating solution is very good. 4. The film thickness deposition rate is fast. 5. Long bath life. 6. 1:1 supplementary addition. |